Philipp Engesser
13Patents
3h-index
18Co-inventors
57Inventor score
Filing activity: Oct 31, 2001 → Oct 1, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7172674B2 | Device for liquid treatment of wafer-shaped articles | Electricity | 9 | Expired |
| US9136155B2 | Method and device for processing wafer shaped articles | Emerging Cross-Sectional Technologies | 6 | Active |
| US7988818B2 | Device for liquid treatment of wafer-shaped articles | Electricity | 4 | Active |
| US7799695B2 | Device for liquid treatment of wafer-shaped articles | Electricity | 3 | Expired |
| US9748120B2 | Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus | Mechanical Engineering; Lighting; Heating | 2 | Active |
| US9597701B2 | Apparatus for treating surfaces of wafer-shaped articles | Chemistry; Metallurgy | 1 | Active |
| US11164748B2 | Method and device for plating a recess in a substrate | Electricity | 1 | Active |
| US9960057B2 | Device for measuring the distribution or impulse of a series of droplets | Electricity | 0 | Active |
| US9870933B2 | Process and apparatus for treating surfaces of wafer-shaped articles | Electricity | 0 | Active |
| US8038804B2 | Method for drying a surface | Electricity | 0 | Active |
| US12351921B2 | Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate | Chemistry; Metallurgy | 0 | Active |
| US11908698B2 | Method and device for plating a recess in a substrate | Electricity | 0 | Active |
| US10249521B2 | Wet-dry integrated wafer processing system | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.