Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste
US11164804B2 · kind B2 · utility
0Cited by
27References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2019 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Jul 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.