SOI substrate compatible with the RFSOI and FDSOI technologies
US11171158B2 · kind B2 · utility
0Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2020 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | May 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/01
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor on insulator type substrate, comprising at least: in which the trap rich layer comprises at least one first region and at least one second region adjacent to each other in the plane of the trap rich layer, the material of the at least one first region being in an at least partially recrystallized state and having an electrical resistivity less than that of the material in the at least one second region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.