Thermal paths for glass substrates
US11177065B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2020 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Mar 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3737
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Examples herein include thermally conductive pathways for glass substrates such as used by passive on glass devices that may be used to enhance the thermal conductivity of an integrated POG device. By using a thermally conductive material for passivation of the device pathways during manufacturing, the device pathways may be able to conduct heat away from the device. For example, by using a selected poly (p-phenylene benzobisoxazole) (PBO) based material (e.g., poly-p-phenylene-2, 6-benzobisoxazole) instead of conventional polyimide (PI) materials during a Cu pattern passivation process, the overall thermal performance of the device, may be enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.