Semiconductor device including magnetic hold-down layer
US11177242B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Mar 10, 2020 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Apr 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed including one or more semiconductor dies mounted on substrate. Each semiconductor die may be formed with a ferromagnetic layer on a lower, inactive surface of the semiconductor die. The ferromagnetic layer pulls the semiconductor dies down against each other and the substrate during fabrication to prevent warping of the dies. The ferromagnetic layer also balances out a mismatch of coefficients of thermal expansion between layers of the dies, thus further preventing warping of the dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.