Method for determining a control parameter for an apparatus utilized in a semiconductor manufacturing process
US11181829B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2018 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Aug 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for determining a control parameter for an apparatus used in a semiconductor manufacturing process, the method including: obtaining performance data associated with a substrate subject to the semiconductor manufacturing process; obtaining die specification data including values of an expected yield of one or more dies on the substrate based on the performance data and/or a specification for the performance data; and determining the control parameter in dependence on the performance data and the die specification data. Advantageously, the efficiency and/or accuracy of processes is improved by determining how to perform the processes in dependence on dies within specification.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.