Patent · US Active

Interconnect clip with angled contact surface and raised bridge

US11183451B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Chai Chee Lee · Melaka City, MY
Wee Boon Tay · Melaka City, MY

Key dates

Filing date	Aug 12, 2020
Grant date	Nov 23, 2021
Priority date	—
Expiry date	Aug 12, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An interconnect clip includes a die contact portion having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a lead contact portion adjoining the bridge portion and having a lead contact surface or contact point, and a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends along a second plane that is completely above the first plane throughout a complete length of the bridge portion. The lead contact surface or contact point is disposed below the first plane.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.