Wee Boon Tay
6Patents
1h-index
21Co-inventors
43Inventor score
Filing activity: Jan 4, 2016 → Aug 12, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9728492B1 | Strip testing of semiconductor devices | Electricity | 2 | Active |
| US9640459B1 | Semiconductor device including a solder barrier | Electricity | 1 | Active |
| US10978378B2 | Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier | Electricity | 0 | Active |
| US11239127B2 | Topside-cooled semiconductor package with molded standoff | Electricity | 0 | Active |
| US11183451B2 | Interconnect clip with angled contact surface and raised bridge | Electricity | 0 | Active |
| US10037934B2 | Semiconductor chip package having contact pins at short side edges | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.