Package substrate processing method and protective tape
US11183464B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2018 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Oct 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package substrate processing method for processing a package substrate in which a plurality of semiconductor chips on a wiring substrate are collectively sealed with a sealing agent is provided. In the package substrate processing method, a protective tape is adhered to the wiring substrate side of the package substrate, the package substrate is divided into a plurality of semiconductor packages, and a shield layer is formed on an upper surface and side surfaces of each package. In this instance, the package substrate is divided in a state in which adhesiveness of an adhesive layer of the protective tape in the periphery of the package substrate is reduced or eliminated, whereby adhesion of a metallic powder scattering at the time of the dividing to the adhesive layer of the protective tape is restrained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.