Electronic substrates having embedded dielectric magnetic material to form inductors
US11189409B2 · kind B2 · utility
1Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2017 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Mar 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/086
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inductor may be fabricated comprising a magnetic material layer and an electrically conductive via or trace extending through the magnetic material layer, wherein the magnetic material layer comprises dielectric magnetic filler particles within a carrier material. Further embodiments may include incorporating the inductor of the present description into an electronic substrate and may further include an integrated circuit device attached to the electronic substrate and the electronic substrate may further be attached to a board, such as a motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.