Inventor · Mesa, AZ, US

Lauren A. Link

17Patents
1h-index
27Co-inventors
46Inventor score

Filing activity: Mar 30, 2017 → Jan 3, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US10700021B2 Coreless organic packages with embedded die and magnetic inductor structures Electricity 2 Active
US11189409B2 Electronic substrates having embedded dielectric magnetic material to form inductors Electricity 1 Active
US11251113B2 Methods of embedding magnetic structures in substrates Electricity 1 Active
US11552008B2 Asymmetric cored integrated circuit package supports Electricity 1 Active
US10741947B2 Plated through hole socketing coupled to a solder ball to engage with a pin Electricity 1 Active
US11335632B2 Magnetic inductor structures for package devices Electricity 0 Active
US11705389B2 Vias for package substrates Electricity 0 Active
US11651902B2 Patterning of thin film capacitors in organic substrate packages Electricity 0 Active
US11610706B2 Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates Electricity 0 Active
US11289263B2 Electronic substrates having embedded magnetic material using photo-imagable dielectric layers Electricity 0 Active
US11444042B2 Magnetic structures in integrated circuit packages Electricity 0 Active
US11205626B2 Coreless organic packages with embedded die and magnetic inductor structures Electricity 0 Active
US11574874B2 Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch Electricity 0 Active
US11075130B2 Package substrate having polymer-derived ceramic core Electricity 0 Active
US11862552B2 Methods of embedding magnetic structures in substrates Electricity 0 Active
US11881463B2 Coreless organic packages with embedded die and magnetic inductor structures Electricity 0 Active
US11824013B2 Package substrate with reduced interconnect stress Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.