Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications
US11196165B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2018 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Apr 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6677
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Embodiments include antennas, methods of forming antennas, and a semiconductor package. An antenna includes a feed port disposed in a substrate, and the feed port having a first patch and a second patch. The first patch is disposed on a top surface of substrate, and the second patch is disposed on a bottom surface of substrate. The antenna includes a photoimageable dielectric (PID) disposed on the bottom surface of substrate, where PID surrounds the second patch. The antenna includes a third patch disposed on PID, where the third patch is below the second patch. The antenna includes a cavity disposed between the second and third patches, where the cavity is enclosed by PID and third patch. An additional antenna includes a patch disposed on a first substrate, and a feed port disposed in a second substrate. This antenna includes a composite layer disposed between the first and second substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.