Methods and apparatus for embedding a wire intermittently
US11203165B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2019 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Sep 29, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C66/472
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A wire embedding system and methods are presented. A wire is embedded in a substrate at predetermined locations in a series of sequential embedding instances using heat and pressure. The heat and pressure are removed from the wire in between the series of sequential embedding instances.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.