Coreless organic packages with embedded die and magnetic inductor structures
US11205626B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2020 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | May 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A coreless semiconductor package comprises a plurality of horizontal layers of dielectric material. A magnetic inductor is situated at least partly in a first group of the plurality of layers. A plated laser stop is formed to protect the magnetic inductor against subsequent acidic processes. An EMIB is situated above the magnetic inductor within a second group of the plurality of layers. Vias and interconnections are configured within the horizontal layers to connect a die of the EMIB to other circuitry. A first level interconnect is formed on the top side of the package to connect to the interconnections. BGA pockets and BGA pads are formed on the bottom side of the package. In a second embodiment a polymer film is used as additional protection against subsequent acidic processes. The magnetic inductor comprises a plurality of copper traces encapsulated in magnetic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.