Handling and processing double-sided devices on fragile substrates
US11205978B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2019 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Jan 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/24
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.