Tubular heat spreaders for memory modules and memory modules incorporating the same
US11206749B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2019 |
| Grant date | Dec 21, 2021 |
| Priority date | — |
| Expiry date | Aug 2, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. For example, a memory module may have a printed circuit board (PCB) having an edge connector, a plurality of memory devices disposed on a surface of the PCB, and a tubular heat spreader disposed along an edge of the PCB opposite the edge connector. The tubular heat spreader may comprise a tubular portion open at both ends thereof to permit the through flow of a cooling gas; and two planar elements extending in parallel away from the tubular portion and configured to provide a friction fit with the memory module. Each of the planar elements may be configured to convey thermal energy from the memory module to the tubular portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.