Photonics package with face-to-face bonding
US11209598B2 · kind B2 · utility
2Cited by
20References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2019 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Feb 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16227
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.