Sylvain Pharand
9Patents
2h-index
25Co-inventors
47Inventor score
Filing activity: Apr 29, 2008 → Oct 23, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8841209B2 | Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method | Electricity | 3 | Active |
| US7482180B1 | Method for determining the impact of layer thicknesses on laminate warpage | Electricity | 2 | Active |
| US8903531B2 | Characterizing laminate shape | Performing Operations; Transporting | 2 | Active |
| US11209598B2 | Photonics package with face-to-face bonding | Electricity | 2 | Active |
| US9111793B2 | Joining a chip to a substrate with solder alloys having different reflow temperatures | Electricity | 1 | Active |
| US9793232B1 | All intermetallic compound with stand off feature and method to make | Electricity | 1 | Active |
| US11310921B2 | Buried via in a circuit board | Electricity | 1 | Active |
| US11404365B2 | Direct attachment of capacitors to flip chip dies | Electricity | 0 | Active |
| US11004614B2 | Stacked capacitors for use in integrated circuit modules and the like | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.