Patent · US Active

Assembly and method for mounting an electronic component to a substrate

US11211304B2 · kind B2 · utility

0Cited by

11References

20Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Ralf Otremba · Kaufbeuren, DE
Guenther Lohmann · Sattendorf, AT
Bernd Schmoelzer · Radenthein, AT
Fabian Schnoy · Regenstauf, DE

Key dates

Filing date	Aug 17, 2018
Grant date	Dec 28, 2021
Priority date	—
Expiry date	Sep 23, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In an embodiment, an assembly includes an electronic component, a fixing member, a resilient member and a substrate having a first surface. The electronic component includes a heat-generating semiconductor device, a die pad and a plastic housing. The heat-generating semiconductor device is mounted on a first surface of the die pad, and the die pad is at least partially embedded in the plastic housing. The resilient member is engaged under compression between an upper side of the electronic component and a lower surface of the fixing member and the fixing member secures the electronic component to the first surface of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.