Patent · US Active

Face-up fan-out electronic package with passive components using a support

US11211337B2 · kind B2 · utility

0Cited by

8References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Lizabeth Keser · Chandler, US
Thomas Ort · Veitsbronn, DE
Thomas Wagner · Regelsbach, DE
Bernd Waidhas · Nittendorf, DE

Key dates

Filing date	Dec 4, 2019
Grant date	Dec 28, 2021
Priority date	—
Expiry date	Dec 4, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/351
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A face-up fan-out electronic package including at least one passive component located on a support. The electronic package can include a die. The die can include a plurality of conductive pillars having a proximal end communicatively coupled to the first side of the die and a distal end opposite the proximal end. A mold can at least partially surround the die. The mold can include a first surface that is coplanar with the distal end of the conductive pillars and a second surface opposing the first surface. In an example, the passive component can include a body and a lead. The passive component can be located within the mold. The lead can be coplanar with the first surface, and the body can be located at a distance from the second surface. The support can be located between the body and the second surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.