Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
US11211340B2 · kind B2 · utility
0Cited by
21References
21Claims
0Family size
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Key dates
| Filing date | Dec 17, 2019 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Dec 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a substrate having a semiconductor chip disposed on a top surface of the substrate, a ground ring surrounding the semiconductor chip on the top surface of the substrate, a metal-post reinforced glue wall disposed on the ground ring to surround the semiconductor chip, and a molding compound disposed only inside the metal-post reinforced glue wall and covering the semiconductor chip. The metal-post reinforced glue wall comprises a magnetic or magnetizable filler so as to form an active electro-magnetic compatibility (EMC) shielding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.