Hsien-Yin Tsai
6Patents
6Active
6Granted
44Portfolio score
Filing activity: Jan 1, 2019 → Sep 23, 2020
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10923435B2 | Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance | Electricity | 1 | Active |
| US11211340B2 | Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding | Electricity | 0 | Active |
| US10896880B2 | Semiconductor package with in-package compartmental shielding and fabrication method thereof | Electricity | 0 | Active |
| US11239179B2 | Semiconductor package and fabrication method thereof | Electricity | 0 | Active |
| US10847480B2 | Semiconductor package with in-package compartmental shielding and fabrication method thereof | Electricity | 0 | Active |
| US11661681B2 | Multifunctional smart garment textile | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.