Chung-Che Tsai
17Patents
7h-index
6Co-inventors
59Inventor score
Filing activity: Aug 15, 2000 → Jul 13, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6713856B2 | Stacked chip package with enhanced thermal conductivity | Electricity | 82 | Expired |
| US6326700A | Low profile semiconductor package and process for making the same | Electricity | 49 | Expired |
| US6713857B1 | Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor package | Electricity | 48 | Expired |
| US6683385B2 | Low profile stack semiconductor package | Electricity | 20 | Expired |
| US6849915B1 | Light sensitive semiconductor package and fabrication method thereof | Electricity | 18 | Expired |
| US6849932B2 | Double-sided thermally enhanced IC chip package | Electricity | 14 | Expired |
| US6555919B1 | Low profile stack semiconductor package | Electricity | 11 | Expired |
| US6857865B2 | Mold structure for package fabrication | Electricity | 5 | Expired |
| US6709894B2 | Semiconductor package and method for fabricating the same | Electricity | 5 | Expired |
| US6911604B2 | Bonding pads of printed circuit board capable of holding solder balls securely | Electricity | 4 | Expired |
| US6968613B2 | Fabrication method of circuit board | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6740540B2 | Fabrication method for circuit board | Emerging Cross-Sectional Technologies | 1 | Expired |
| US10923435B2 | Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance | Electricity | 1 | Active |
| US10896880B2 | Semiconductor package with in-package compartmental shielding and fabrication method thereof | Electricity | 0 | Active |
| US11239179B2 | Semiconductor package and fabrication method thereof | Electricity | 0 | Active |
| US11211340B2 | Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding | Electricity | 0 | Active |
| US10847480B2 | Semiconductor package with in-package compartmental shielding and fabrication method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.