Patent · US Active

Power semiconductor device package

US11222832B2 · kind B2 · utility

1Cited by

4References

21Claims

0Family size

Assignee

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC · US

Inventors

Tiburcio A. Maldo · Suzhou, CN
Keunhyuk LEE · Suzhou, CN
Jerome Teysseyre · Scottsdale, US

Key dates

Filing date	Jul 16, 2019
Grant date	Jan 11, 2022
Priority date	—
Expiry date	Jul 16, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a general aspect, an apparatus can include a leadframe. The apparatus can also include a first semiconductor die coupled with a first side of a first portion of the leadframe, and a second semiconductor die coupled with a second side of the first portion of the leadframe. The apparatus can also include a first substrate coupled with a second side of the first semiconductor die. The first substrate can be further coupled with a first side of a second portion of the leadframe and a first side of a third portion of the leadframe. The apparatus can also further include a second substrate coupled with a second side of the second semiconductor die. The second substrate can be further coupled with a second side of the second portion of the leadframe and a second side of the third portion of the leadframe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.