Connecting a component to a substrate by adhesion to an oxidized solder surface
US11228124B1 · kind B1 · utility
0Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2021 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Jan 4, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In some embodiments, connecting a component to a substrate by adhesion to an oxidized solder surface includes: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; adhering the component to an oxidized surface of a solder portion applied to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.