High reliability lead-free solder alloys for harsh environment electronics applications
US11229979B2 · kind B2 · utility
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2References
12Claims
0Family size
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Key dates
| Filing date | May 5, 2016 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | May 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics. An additive selected from 0.1-2.5 wt. % of Bi and/or 0.1-4.5 wt. % of In may be included in the solder alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.