Cobalt chemistry for smooth topology
US11230778B2 · kind B2 · utility
0Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2019 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Apr 29, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.