Substrate treating method and substrate treating apparatus
US11232942B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 14, 2020 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | May 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for treating a substrate is provided. The method includes supplying a first treating liquid to a treating target surface of the substrate while the substrate is rotating, and subsequently, supplying a second treating liquid having a surface tension lower than a surface tension of the first treating liquid to the substrate while an evaporation inhibiting agent in a vapor state is present around the first treating liquid supplied to the substrate, such that the first treating liquid on the substrate is substituted with the second treating liquid. Thus, a vapor atmosphere may be formed around a cleaning liquid applied to the substrate. Thus, a liquid-film destroying phenomenon may be prevented in a procedure in which the cleaning liquid is replaced with an organic solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.