Patent · US Active

Physical vapor deposition system and processes

US11237473B2 · kind B2 · utility

0Cited by

16References

13Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Vibhu Jindal · Milpitas, US
Wen Xiao · Shanghai, CN
Sanjay Bhat · Singapore, SG

Key dates

Filing date	Feb 26, 2020
Grant date	Feb 1, 2022
Priority date	—
Expiry date	Feb 26, 2040

Classification

Technology area (CPC G)Physics
CPC primaryG03F1/52
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed. Chambers and methods are described that provide a chamber comprising an upper shield with two holes that are positioned to permit alternate sputtering from two targets. A process for improving reflectivity from a multilayer stack is also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.