Semiconductor packages including die over-shift indicating patterns
US11239177B2 · kind B2 · utility
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8References
6Claims
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Key dates
| Filing date | May 27, 2020 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | May 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a package substrate including a die attachment region, a semiconductor die attached to the die attachment region, and a die over-shift indicating pattern disposed on or in the package substrate and spaced apart from the die attachment region. The die over-shift indicating pattern is used as a reference pattern for obtaining a shifted distance of the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.