Curved pillar interconnects
US11239400B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2020 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Jan 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting diode (LED) array is formed by bonding an LED chip or wafer to a backplane substrate via curved interconnects. The backplane substrate may include circuits for driving the LED's. One or more curved interconnects are formed on the backplane substrate. A curved interconnect may be electrically connected to a corresponding circuit of the backplane substrate, and may include at least a portion with curvature. The LED chip or wafer may include one or more LED devices. Each LED device may have one or more electrical contacts. The LED chip or wafer is positioned above the backplane substrate to spatially align electrical contacts of the LED devices with the curved interconnects on the backplane substrate. The electrical contacts are bonded to the curved interconnects to electrically connect the LED devices to corresponding circuits of the backplane substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.