Jeb Wu
17Patents
2h-index
30Co-inventors
46Inventor score
Filing activity: Mar 13, 2015 → May 23, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10162181B2 | Display device with optics for brightness uniformity tuning having DOE optically coupled to receive light at central and peripheral regions | Physics | 33 | Active |
| US9726891B2 | Left and right eye optical paths with shared optical element for head-mounted display device | Physics | 5 | Active |
| US11255529B1 | Bonding corners of light emitting diode chip to substrate using laser | Electricity | 2 | Active |
| US11296268B1 | Magnetic clamping interconnects | Electricity | 2 | Active |
| US11349053B1 | Flexible interconnect using conductive adhesive | Electricity | 2 | Active |
| US11424214B1 | Hybrid interconnect for laser bonding using nanoporous metal tips | Electricity | 2 | Active |
| US11239400B1 | Curved pillar interconnects | Electricity | 1 | Active |
| US11374148B2 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Electricity | 1 | Active |
| US11417792B1 | Interconnect with nanotube fitting | Electricity | 1 | Active |
| US11391967B1 | Transparent circuit boards with multilayered traces | Electricity | 1 | Active |
| US11563142B2 | Curing pre-applied and plasma-etched underfill via a laser | Electricity | 0 | Active |
| US11735689B2 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Electricity | 0 | Active |
| US11557692B2 | Selectively bonding light-emitting devices via a pulsed laser | Electricity | 0 | Active |
| US11404600B2 | Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers | Electricity | 0 | Active |
| US11575069B2 | Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers | Electricity | 0 | Active |
| US11276672B1 | Bonding dummy electrodes of light emitting diode chip to substrate | Electricity | 0 | Active |
| US10088689B2 | Light engine with lenticular microlenslet arrays | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.