Measurement method and apparatus
US11243473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2018 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | May 28, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70616
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method involving obtaining a simulation of a contour of a pattern to be formed on a substrate using a patterning process, determining a location of an evaluation point on the simulated contour of the pattern, the location spatially associated with a location of a corresponding evaluation point on a design layout for the pattern, and producing electronic information corresponding to a spatial bearing between the location of the evaluation point on the simulated contour and the location of the corresponding evaluation point on the design layout, wherein the information corresponding to the spatial bearing is configured for determining a location of an evaluation point on a measured image of at least part of the pattern, the evaluation point on the measured image spatially associated with the corresponding evaluation point on the design layout.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.