Semiconductor package
US11244879B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2020 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Apr 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package including a first semiconductor device, a second semiconductor device, an insulating encapsulant, a redistribution structure and a supporting element is provided. The insulating encapsulant encapsulates the first semiconductor device and the second semiconductor device. The redistribution structure is over the first semiconductor device, the second semiconductor device and the insulating encapsulant. The redistribution structure is electrically connected to the first semiconductor device and the second semiconductor device. The supporting element is embedded in one of the insulating encapsulant and the redistribution structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.