Patent · US Active

Package cooled with cooling fluid and comprising shielding layer

US11244886B2 · kind B2 · utility

0Cited by

1References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Andreas Grassmann · Villach, AT
Wolfram Hable · Dresden, DE
Juergen Hoegerl · Regensburg, DE
Ivan Nikitin · Regensburg, DE
Achim Strass · Munich, DE

Key dates

Filing date	Sep 21, 2017
Grant date	Feb 8, 2022
Priority date	—
Expiry date	Dec 24, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package which comprises at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and a shielding layer on at least part of an external surface of the encapsulant configured for shielding an interior of the package with regard to cooling fluid for removing thermal energy from the at least one electronic chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.