Patent · US Active

High density and fine pitch interconnect structures in an electric test apparatus

US11249113B2 · kind B2 · utility

0Cited by
24References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 3, 2020
Grant dateFeb 15, 2022
Priority date—
Expiry dateDec 3, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/14
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An electrical-test apparatus is provided, which includes a MEMS array. In an example, the MEMS array comprises a plurality of tester interconnect structures cantilevered from first terminals on a first side of a substrate. The tester interconnect structures may have a first diameter. In an example, the MEMS array comprises a plurality of through-substrate vias that extend through the substrate, the vias having a second diameter larger than the first diameter. In an example, individual ones of the vias electrically couple individual ones of the tester interconnect structures to corresponding ones of second terminals on a second side of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.