Prober and method of preheating probe card
US11249132B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 24, 2020 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Jun 24, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
There is provided a prober including inspection rooms. Each of the inspection rooms includes: a probe card having probes; a chuck top configured to mount a wafer; and a temperature adjuster configured to adjust a temperature of the chuck top. At least one of the probe card and the chuck top includes a gap adjustment member configured to maintain a constant gap between the probe card and the chuck top. The probe card is preheated by heat of the chuck top whose temperature is adjusted by the temperature adjuster, in a state in which the wafer is not mounted on the chuck top and in a state in which the probe card and the chuck top are connected with each other via the gap adjustment member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.