Patent · US Active

Material deposition prevention on a workpiece in a process chamber

US11251026B2 · kind B2 · utility

1Cited by

6References

16Claims

0Family size

Assignees

Mattson Technology, Inc. · US
Beijing E-Town Semiconductor Technology Co., Ltd. · CN

Inventors

Jeffrey Cue · Fremont, US
Martin L. Zucker · Orinda, US

Key dates

Filing date	Mar 27, 2018
Grant date	Feb 15, 2022
Priority date	—
Expiry date	Jul 20, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/334
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Focus ring assemblies for plasma processing apparatus are provided. In one example implementation, an apparatus includes a plasma source configured to generate a plasma. The apparatus includes a chamber configured to receive a workpiece. The apparatus includes a workpiece support contained in the chamber and configured to support the workpiece. The apparatus includes a focus ring assembly. The focus ring assembly includes a focus ring having an upper tier and a lower tier. An inner edge of the upper tier can be separated a lateral distance of at least about 3 mm from an outer edge of the workpiece located on the workpiece support.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.