Method of forming a structure on a substrate
US11251035B2 · kind B2 · utility
4Cited by
2,092References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2020 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Sep 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02315
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method of providing a structure by depositing a layer on a substrate in a reactor. The method comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.