Cyclical deposition method including treatment step and apparatus for same
US11251040B2 · kind B2 · utility
1Cited by
2,092References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2020 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Apr 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76224
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for depositing a material on a surface of a substrate are disclosed. The method can include a treatment step to suppress a rate of material deposition on the surface of the substrate. The method can result in higher-quality deposited material. Additionally or alternatively, the method can be used to fill a recess within the surface of the substrate with reduced or no seam formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.