Bonding corners of light emitting diode chip to substrate using laser
US11255529B1 · kind B1 · utility
2Cited by
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13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2019 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | May 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.