Methods for processing a workpiece using fluorine radicals
US11257680B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 25, 2020 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Aug 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for processing a workpiece with fluorine radicals are provided. In one example implementation, the method includes a workpiece having at least one silicon layer and at least one silicon germanium layer. The method can include placing the workpiece on a workpiece support in a processing chamber. The method can include generating one or more species from a process gas in a plasma chamber. The method can include filtering the one or more species to create a filtered mixture. The method can include exposing the workpiece to the filtered mixture to remove at least a portion of the at least one silicon layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.