Substrate processing apparatus
US11257691B2 · kind B2 · utility
2Cited by
1References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 25, 2019 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Oct 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/2421
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provision of a substrate processing apparatus including an inner edge ring provided in a vicinity of a substrate to be placed on a stage in a processing chamber; a middle edge ring arranged outside the inner edge ring, the middle edge ring being configured to be moved vertically by an actuation mechanism; an outer edge ring arranged outside the middle edge ring; a first spring provided between the inner edge ring and the middle edge ring; and a second spring provided between the middle edge ring and the outer edge ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.