Substrate processing apparatus, substrate processing method and recording medium
US11257701B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2019 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Oct 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes a transfer device configured to transfer at least one substrate as a processing target; a transfer controller configured to control the transfer device to perform a normal transfer of transferring the substrate and a high-accuracy transfer of transferring the substrate with higher positioning accuracy as compared to the normal transfer; a warm-up controller configured to control the transfer device to perform a warm-up operation, which is different from the normal transfer and the high-accuracy transfer, when necessary; and a necessity determination unit configured to make a determination that the warm-up operation is required as a beginning of the high-accuracy transfer is approaching when a duration of a stop state of the transfer device exceeds a preset reference time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.