Integrated fan-out packages and methods of forming the same
US11257715B2 · kind B2 · utility
0Cited by
22References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2019 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Oct 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a semiconductor device includes attaching a metal foil to a carrier, the metal foil being pre-made prior to attaching the metal foil; forming a conductive pillar on a first side of the metal foil distal the carrier; attaching a semiconductor die to the first side of the metal foil; forming a molding material around the semiconductor die and the conductive pillar; and forming a redistribution structure over the molding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.