Inventor · Taipei, TW

Long Hua Lee

17Patents
4h-index
26Co-inventors
60Inventor score

Filing activity: Aug 28, 2003 → Apr 3, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9337063B2 Package for three dimensional integrated circuit Electricity 7 Active
US8941244B1 Semiconductor device and manufacturing method thereof Electricity 7 Active
US6852358B1 Process for preparing an optical waveguide component from acrylate/titanium alkoxide composite material and the prepared optical waveguide component Physics 5 Expired
US8963334B2 Die-to-die gap control for semiconductor structure and method Electricity 5 Active
US11075133B2 Underfill structure for semiconductor packages and methods of forming the same Electricity 3 Active
US8772929B2 Package for three dimensional integrated circuit Electricity 2 Active
US11024616B2 Package structure and method of manufacturing the same Electricity 2 Active
US10157879B2 Die-to-die gap control for semiconductor structure and method Electricity 1 Active
US12148661B2 Method of forming integrated fan-out packages with built-in heat sink Electricity 0 Active
US8629043B2 Methods for de-bonding carriers Electricity 0 Active
US11621205B2 Underfill structure for semiconductor packages and methods of forming the same Electricity 0 Active
US12080617B2 Underfill structure for semiconductor packages and methods of forming the same Electricity 0 Active
US11121050B2 Method of manufacture of a semiconductor device Electricity 0 Active
US11257715B2 Integrated fan-out packages and methods of forming the same Electricity 0 Active
US11842936B2 Underfill structure for semiconductor packages and methods of forming the same Electricity 0 Active
US10510595B2 Integrated fan-out packages and methods of forming the same Electricity 0 Active
US11201097B2 Method of manufacture of a semiconductor device Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.