Micromechanical device and method for manufacturing a micromechanical device

US11261082B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Eckhard Graf · Gomaringen, DE
• Holger Rumpf · Reutlingen, DE
• Jens Frey · Echterdingen, DE
• Jochen Reinmuth · Reutlingen, DE
• Kurt-Ulrich Ritzau · Lörrach, DE
• Achim Breitling · Echterdingen, DE

Key dates

• Filing date: Dec 17, 2019
• Grant date: Mar 1, 2022
• Expiry date: May 17, 2040

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0172
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A micromechanical device that includes a silicon substrate with an overlying oxide layer and with a micromechanical functional layer lying above same, which extend in parallel to a main extension plane, a cavity being formed at least in the micromechanical functional layer and in the oxide layer. An access channel is formed in the oxide layer and/or in the micromechanical functional layer which, starting from the cavity, extends in parallel to the main extension plane and in the process extends in a projection direction, as viewed perpendicularly to the main extension plane, all the way into an access area outside the cavity. A method for manufacturing a micromechanical device is also described.