Patent · US Active

Device for positioning a semiconductor die in a wafer prober

US11262381B2 · kind B2 · utility

1Cited by

5References

18Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Otto A. Torreiter · Echterdingen, DE
Jörg Georg Appinger · Aidlingen, DE
Martin Eckert · Metzingen, DE
Quintino L. Trianni · Balingen, DE

Key dates

Filing date	Jan 10, 2020
Grant date	Mar 1, 2022
Priority date	—
Expiry date	Jul 9, 2040

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2891
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The invention relates to a device for positioning a semiconductor die in a wafer prober, the device comprising a carrier plate and a clamp on a front surface of the carrier plate, the dimensions of the carrier plate matching a standard geometry required by the wafer prober for receiving a semiconductor wafer to be probed by the wafer prober, the clamp being reversibly movable against a force of an elastic element between an open position and a closed position, the clamp being adapted for fixing the die on the carrier plate in the closed position and for releasing the die in the open position.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.