Patent · US Active

Circuit board, chip cooling housing, assembly and method for cooling a semiconductor chip

US11266012B2 · kind B2 · utility

4Cited by

6References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Tomas Manuel Reiter · Munich, DE
Mark Nils Muenzer · Neubiberg, DE
Andre Uhlemann · Dortmund, DE

Key dates

Filing date	Dec 12, 2019
Grant date	Mar 1, 2022
Priority date	—
Expiry date	Feb 20, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10166
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A circuit board includes an electrically insulating part and an electrically conductive part. At least one semiconductor chip is embedded into the electrically insulating part in a part of the circuit board. Through openings in the part of the circuit board provide for passage of a cooling liquid. The through openings extend from a first surface of the circuit board to a second surface of the circuit board. The electrically conductive part includes a first outer conductive layer on the first surface and a second outer conductive layer on the second surface. The electrically conductive part also includes a first inner conductive layer which is electrically connected to the semiconductor chip. The first inner conductive layer is electrically insulated from the first outer conductive layer and from the second outer conductive layer by the electrically insulating part in the part of the circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.