Inventor · Dortmund, DE

Andre Uhlemann

11Patents

4h-index

17Co-inventors

53Inventor score

Filing activity: Sep 12, 2011 → Mar 1, 2022

Most-cited inventions

Patent	Title	Area	Cited by	Status
US8963321B2	Semiconductor device including cladded base plate	Electricity	275	Active
US9275926B2	Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip	Electricity	19	Active
US8519532B2	Semiconductor device including cladded base plate	Electricity	7	Active
US9578789B2	Power semiconductor module with liquid cooling	Electricity	5	Active
US11266012B2	Circuit board, chip cooling housing, assembly and method for cooling a semiconductor chip	Electricity	4	Active
US9731370B2	Directly cooled substrates for semiconductor modules and corresponding manufacturing methods	Electricity	3	Active
US8872332B2	Power module with directly attached thermally conductive structures	Electricity	1	Active
US11810889B2	External contact element for a power semiconductor module and power semiconductor module	Electricity	0	Active
US11598904B2	Power semiconductor module and method for producing a power semiconductor module	Electricity	0	Active
US11778735B2	Circuit board having a cooling area above and below a semiconductor chip	Electricity	0	Active
US11631974B2	Snubber circuit and power semiconductor module with snubber circuit	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.